Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT72605L20J | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 209 K |
IDT72605L20PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
IDT72605L25G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72605L25J | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 209 K |
IDT72605L25PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
IDT72605L35G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72605L35PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
IDT72605L50G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72605L50J | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 209 K |
IDT72605L50PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
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