| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 5962-9172601M3A | SCAN TEST DEVICES WITH OCTAL BUFFERS | Texas-Instruments | FK | 28 | -55°C | 125°C | 293 K |
| 5962-9172601M3A | SCAN TEST DEVICES WITH OCTAL BUFFERS | Texas-Instruments | FK | 28 | -55°C | 125°C | 293 K |
| IDT72605L20PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
| IDT72605L25PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
| IDT72605L35PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
| IDT72605L50PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
| LD7260 | 5.85 - 6.425GHz, 2.25KW TWT for Satellite Ground Terminals | NEC-Electronics-Inc- | - | - | - | - | 62 K |
| TISP7260F3DR | Triple Symmetrical Overvoltage TISP for 3 Wire ISDN / Interwire Protection | Power-Innovations | DR | - | - | - | 489 K |
| TISP7260F3P | Triple Symmetrical Overvoltage TISP for 3 Wire ISDN / Interwire Protection | Power-Innovations | P | - | - | - | 489 K |
| TISP7260F3SL | Triple Symmetrical Overvoltage TISP for 3 Wire ISDN / Interwire Protection | Power-Innovations | SL | - | - | - | 489 K |
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