Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
5962-9466308QYA | Non-RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish solder. Radiation none. | distributor | FlatPack | 100 | -55°C | 125°C | 47 K |
5962-9475808QYA | Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish solder. Class Q. Device type 08 (SuMMIT XTE 5V/5V). Radiation none. | distributor | FlatPack | 140 | - | - | 47 K |
5962F9475408QYA | Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
5962G9475408QYA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
5962G9475408QYA | Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
5962H9475408QYA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
5962R9475408QYA | Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
1 |
---|