Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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MH16S64APHB-6 | 1,073,741,824-bit (16,777,216-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 688 K |
MH16S64APHB-7 | 1,073,741,824-bit (16,777,216-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 688 K |
MH16S64APHB-8 | 1,073,741,824-bit (16,777,216-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 688 K |
MH16S72APHB-6 | 1,207,959,552-bit (16,777,216-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 691 K |
MH16S72APHB-7 | 1,207,959,552-bit (16,777,216-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 691 K |
MH16S72APHB-7 | 1,207,959,552-bit (16,777,216-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 691 K |
MH16S72APHB-8 | 1,207,959,552-bit (16,777,216-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 691 K |
MH32S64APHB-6 | 2,147,483,648-bit (33,554,432-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 699 K |
MH32S64APHB-7 | 2,147,483,648-bit (33,554,432-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 699 K |
TNETE2201APHD | 1.25-GIGABIT ETHERNET TRANSCEIVER | Texas-Instruments | PHD | 64 | 0°C | 70°C | 254 K |
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