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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
MH16S64APHB-61,073,741,824-bit (16,777,216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C688 K
MH16S64APHB-71,073,741,824-bit (16,777,216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C688 K
MH16S64APHB-81,073,741,824-bit (16,777,216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C688 K
MH16S72APHB-61,207,959,552-bit (16,777,216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C691 K
MH16S72APHB-71,207,959,552-bit (16,777,216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C691 K
MH16S72APHB-71,207,959,552-bit (16,777,216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C691 K
MH16S72APHB-81,207,959,552-bit (16,777,216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C691 K
MH32S64APHB-62,147,483,648-bit (33,554,432-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C699 K
MH32S64APHB-72,147,483,648-bit (33,554,432-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C699 K
TNETE2201APHD 1.25-GIGABIT ETHERNET TRANSCEIVERTexas-InstrumentsPHD640°C70°C254 K
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