Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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CMX208S1 | ISDN dual telephony protocol engine | MX-COM-Inc- | QFP | 80 | -40°C | 85°C | 409 K |
CMX218S1 | ISDN data and telephony protocol engine | MX-COM-Inc- | QFP | 80 | -40°C | 85°C | 443 K |
CMX228S1 | ISDN data and telephony protocol engine with x.25 | MX-COM-Inc- | QFP | 80 | -40°C | 85°C | 455 K |
CMX264D5 | Frequency domain split-band scrambler | MX-COM-Inc- | SSOP | 24 | -40°C | 85°C | 470 K |
CMX269AD3 | 1200/2400/4800bps MSK modem | MX-COM-Inc- | SOIC | 20 | -40°C | 85°C | 277 K |
CMX269AE2 | 1200/2400/4800bps MSK modem | MX-COM-Inc- | TSSOP | 24 | -40°C | 85°C | 277 K |
CMX269AP6 | 1200/2400/4800bps MSK modem | MX-COM-Inc- | PDIP | 22 | -40°C | 85°C | 277 K |
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