| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| K9F3208W0A-TCB0 | 4M x 8 bit NAND flash memory | Samsung-Electronic | TSOP II | 40 | 0°C | 70°C | 558 K |
| K9F3208W0A-TIB0 | 4M x 8 bit NAND flash memory | Samsung-Electronic | TSOP II | 40 | -40°C | 85°C | 558 K |
| RD28F3208C3B70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3B90 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3T70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3T90 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3T90 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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