| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| FAR-F6CE1G6190-K222-V | Piezoelectric SAW BPF(700 to 1700 MHz) | Fujitsu-Microelectronis | SMT | 6 | -30°C | 85°C | 515 K |
| FAR-F6CE1G6190-K222-U | Piezoelectric SAW BPF(700 to 1700 MHz) | Fujitsu-Microelectronis | SMT | 6 | -30°C | 85°C | 515 K |
| FAR-F6CE1G6190-K222-W | Piezoelectric SAW BPF (700 to 1700 MHz) | Fujitsu-Microelectronis | SMT | 6 | -30°C | 85°C | 515 K |
| LNG61LCF6 | Round Type visible light emitting diode | Panasonic---Semiconductor-Company-of-Matsushita-Electronics-Corporation | - | - | - | - | 28 K |
| MG61D | Solid state indicator | distributor | Epoxy | 2 | -55°C | 100°C | 57 K |
| PVG612 | HEXFET power mosfet photovoltaic relay | International-Rectifier | DIP | 6 | -40°C | 85°C | 274 K |
| PVG612S | HEXFET power mosfet photovoltaic relay | International-Rectifier | DIP | 6 | -40°C | 85°C | 274 K |
| PVG612S-T | HEXFET power mosfet photovoltaic relay | International-Rectifier | DIP | 6 | -40°C | 85°C | 274 K |
| SG6100F | Diode Array | Microsemi-Corporation | Flatpack | - | - | - | 34 K |
| SG6101J | Diode Array | Microsemi-Corporation | DIP | - | - | - | 34 K |
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