| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| BYT08PI-1000 | FAST RECOVERY RECTIFIER DIODE | SGS-Thomson-Microelectronics | - | - | - | - | 38 K |
| BYT12PI-1000 | FAST RECOVERY RECTIFIER DIODE | SGS-Thomson-Microelectronics | - | - | - | - | 86 K |
| BYT30PI-1000 | FAST RECOVERY RECTIFIER DIODE | SGS-Thomson-Microelectronics | - | - | - | - | 63 K |
| HI-8582CJI-10 | ARINC 429 system on a chip | distributor | SERQUAD | 52 | -40°C | 85°C | 419 K |
| HI-8582PQI-10 | ARINC 429 system on a chip | distributor | PQFP | 52 | -40°C | 85°C | 419 K |
| HI-8583CJI-10 | ARINC 429 system on a chip | distributor | SERQUAD | 52 | -40°C | 85°C | 419 K |
| HI-8583PQI-10 | ARINC 429 system on a chip | distributor | PQFP | 52 | -40°C | 85°C | 419 K |
| HM6264BLFPI-10T | 64k SRAM (8-kword x 8-bit) wide temperature range version, 100ns access time | distributor | plastic SOP | 28 | -40°C | 85°C | 72 K |
| HM6264BLPI-10 | 64k SRAM (8-kword x 8-bit) wide temperature range version, 100ns access time | distributor | plastic DIP | 28 | -40°C | 85°C | 72 K |
| W24L011AI-10 | 128K*8 high speed, low power CMOS static RAM | Winbond-Electronics | SOJ32 | 32 | 0°C | 70°C | 131 K |
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