| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| QL2009-0PB256C | 3.3V and 5.0V pASIC 2 FPGA combining speed, density, low cost and flexibility. | distributor | PBGA | 256 | 0°C | 70°C | 272 K |
| QL2009-0PB256I | 3.3V and 5.0V pASIC 2 FPGA combining speed, density, low cost and flexibility. | distributor | PBGA | 256 | -40°C | 85°C | 272 K |
| QL2009-1PB256C | 3.3V and 5.0V pASIC 2 FPGA combining speed, density, low cost and flexibility. | distributor | PBGA | 256 | 0°C | 70°C | 272 K |
| QL2009-1PB256I | 3.3V and 5.0V pASIC 2 FPGA combining speed, density, low cost and flexibility. | distributor | PBGA | 256 | -40°C | 85°C | 272 K |
| QL2009-2PB256C | 3.3V and 5.0V pASIC 2 FPGA combining speed, density, low cost and flexibility. | distributor | PBGA | 256 | 0°C | 70°C | 272 K |
| QL2009-2PB256I | 3.3V and 5.0V pASIC 2 FPGA combining speed, density, low cost and flexibility. | distributor | PBGA | 256 | -40°C | 85°C | 272 K |
| QL3025-0PB256C | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PBGA | 256 | 0°C | 70°C | 582 K |
| QL3025-1PB256C | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PBGA | 256 | 0°C | 70°C | 582 K |
| SPB25 | Single Phase Bridge | Microsemi-Corporation | MB | - | - | - | 88 K |
| SPB25JAN | Single Phase Bridge | Microsemi-Corporation | MB | - | - | - | 88 K |
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