| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| PC817X | Photocoupler | Sharp | DIP | 4 | -30°C | 100°C | 511 K |
| PC817X1 | Photocoupler | Sharp | DIP | 4 | -30°C | 100°C | 511 K |
| PC817X2 | Photocoupler | Sharp | DIP | 4 | -30°C | 100°C | 511 K |
| PC817X3 | Photocoupler | Sharp | DIP | 4 | -30°C | 100°C | 511 K |
| PC817X4 | Photocoupler | Sharp | DIP | 4 | -30°C | 100°C | 511 K |
| PC817X5 | Photocoupler | Sharp | DIP | 4 | -30°C | 100°C | 511 K |
| UPC8172TB | Frequency up-converter IC | NEC-Electronics-Inc- | - | - | - | - | 79 K |
| UPC8172TB-E3 | Frequency up-converter IC | NEC-Electronics-Inc- | - | - | - | - | 79 K |
| UPC8179TB | Low-power silicon high-frequency amplifier ICs for cellular/cordless phones | NEC-Electronics-Inc- | - | - | - | - | 154 K |
| UPC8179TB-E3 | Low-power silicon high-frequency amplifier ICs for cellular/cordless phones | NEC-Electronics-Inc- | - | - | - | - | 154 K |
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