Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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SP312ECA | High-performance RS-232 line drivers/receivers | Sipex-Corporation | SSOP | 20 | 0°C | 70°C | 172 K |
SP312ECP | High-performance RS-232 line drivers/receivers | Sipex-Corporation | PDIP | 18 | 0°C | 70°C | 172 K |
SP312ECT | High-performance RS-232 line drivers/receivers | Sipex-Corporation | SOIC | 18 | 0°C | 70°C | 172 K |
SP312EEA | High-performance RS-232 line drivers/receivers | Sipex-Corporation | SSOP | 20 | -40°C | 85°C | 172 K |
SP312EEP | High-performance RS-232 line drivers/receivers | Sipex-Corporation | PDIP | 18 | -40°C | 85°C | 172 K |
SP312EET | High-performance RS-232 line drivers/receivers | Sipex-Corporation | SOIC | 18 | -40°C | 85°C | 172 K |
TISP3125F3D | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | D | - | - | - | 451 K |
TISP3125F3DR | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | DR | - | - | - | 451 K |
TISP3125F3P | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | P | - | - | - | 451 K |
TISP3125F3SL | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | SL | - | - | - | 451 K |
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