Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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UT8R128K32-15WCA | 128K x 32 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
UT8R128K32-15WCC | 128K x 32 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
UT8R128K32-15WCC | 128K x 32 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 68 | -55°C | 125°C | 180 K |
UT8R128K32-15WPC | 128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow. | distributor | Ceramic flatpack | 68 | - | - | 180 K |
UT8R128K32-15WPC | 128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow. | distributor | Ceramic flatpack | 68 | - | - | 180 K |
UT8R128K32-15WPC | 128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow. | distributor | Ceramic flatpack | 68 | - | - | 180 K |
UT8R128K32-15WWC | 128K x 32 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
UT8R128K32-15WWC | 128K x 32 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
UT8R128K32-15WWX | 128K x 32 SRAM. 15ns access time. Lead finish factory option. | distributor | Ceramic flatpack | 68 | -40°C | 125°C | 180 K |
UT8R256K1615TBDCA | 256K x 16 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | TBD | 48 | -55°C | 125°C | 94 K |
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