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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
TESVSP0E106M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
TESVSP0E685M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
TESVSP0G106M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
TESVSP0G475M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
TESVSP0G685M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
TESVSP0J106M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
TESVSP0J335M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
TESVSP0J475M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
TESVSP0J685M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
TESVSP1C225M8RResign molded chip ultra miniaturizedNEC-Electronics-Inc-P CASE---124 K
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