Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
CY7C1310V18-167BZC | 18-Mb SRAM two-word burst architecture, 167MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 445 K |
CY7C1312V18-167BZC | 18-Mb SRAM two-word burst architecture, 167MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 445 K |
CY7C1314V18-167BZC | 18-Mb SRAM two-word burst architecture, 167MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 445 K |
CY7C1316V18-167BZC | 18-Mb DDR-II SRAM two-word burst architecture, 167MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 442 K |
CY7C1318V18-167BZC | 18-Mb DDR-II SRAM two-word burst architecture, 167MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 442 K |
CY7C1320V18-167BZC | 18-Mb DDR-II SRAM two-word burst architecture, 167MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 442 K |
CY7C1380CV25-167AC | 512K x 36 pipelined SRAM, 167MHz | Cypress-Semiconductor | TQFP | 100 | 0°C | 70°C | 519 K |
CY7C1380CV25-167AI | 512K x 36 pipelined SRAM, 167MHz | Cypress-Semiconductor | TQFP | 100 | -40°C | 85°C | 519 K |
CY7C1380CV25-167BGC | 512K x 36 pipelined SRAM, 167MHz | Cypress-Semiconductor | PBGA | 119 | 0°C | 70°C | 519 K |
CY7C1380CV25-167BGI | 512K x 36 pipelined SRAM, 167MHz | Cypress-Semiconductor | PBGA | 119 | -40°C | 85°C | 519 K |
[1] 2 [3] |
---|