| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT22VP10T-20PCC | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-20PCX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-20UCA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-20UCX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-20WCA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish solder. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10T-20WCX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish optional. | distributor | Quad flatpack | 28 | -55°C | 125°C | 287 K |
| UT22VP10T-20WPA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | distributor | Quad flatpack | 28 | - | - | 287 K |
| UT22VP10T-20WPA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | distributor | Quad flatpack | 28 | - | - | 287 K |
| UT22VP10T-20WPC | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | distributor | Quad flatpack | 28 | - | - | 287 K |
| UT22VP10T-20WPC | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | distributor | Quad flatpack | 28 | - | - | 287 K |
| UT22VP10T-20WPX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | distributor | Quad flatpack | 28 | - | - | 287 K |
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