| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT22VP10C-20UCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10C-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-20UCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-20UCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-20UCA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-20UCX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT9Q512-20UPC | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. Prototype flow. | distributor | Ceramic flatpack | 36 | - | - | 128 K |
| UT9Q512-20UWX | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 128 K |
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