Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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27C256-90/L | 256K (32x8) CMOS EPROM | Microchip-Technology-Inc- | PLCC32 | 32 | 0°C | 70°C | 67 K |
27C256-90/P | 256K (32x8) CMOS EPROM | Microchip-Technology-Inc- | - | 28 | 0°C | 70°C | 67 K |
27C256-90/SO | 256K (32x8) CMOS EPROM | Microchip-Technology-Inc- | - | 28 | 0°C | 70°C | 67 K |
27C256-90/TS | 256K (32x8) CMOS EPROM | Microchip-Technology-Inc- | TSOP | 28 | 0°C | 70°C | 67 K |
27C256-90/VS | 256K (32x8) CMOS EPROM | Microchip-Technology-Inc- | VSOP | 28 | 0°C | 70°C | 67 K |
27C256-90I/VS | 256K (32x8) CMOS EPROM | Microchip-Technology-Inc- | VSOP | 28 | -40°C | 85°C | 67 K |
FAR-F5CH-902M50-L2EW-R | Piezoelectric SAW BPF (700 to 1000 MHz) | Fujitsu-Microelectronis | SMT | 6 | -30°C | 85°C | 441 K |
MB84VD2229XEE-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 8M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic FBGA | 71 | -25°C | 85°C | 1 M |
MB84VD23280EA-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 64M(x8/x16) flash memory & 8M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic FBGA | 101 | -25°C | 85°C | 771 K |
MB84VD23280EE-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 64M(x8/x16) flash memory & 8M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic FBGA | 101 | -25°C | 85°C | 771 K |
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