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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
27C256-90/L256K (32x8) CMOS EPROMMicrochip-Technology-Inc-PLCC32320°C70°C67 K
27C256-90/P256K (32x8) CMOS EPROMMicrochip-Technology-Inc--280°C70°C67 K
27C256-90/SO256K (32x8) CMOS EPROMMicrochip-Technology-Inc--280°C70°C67 K
27C256-90/TS256K (32x8) CMOS EPROMMicrochip-Technology-Inc-TSOP280°C70°C67 K
27C256-90/VS256K (32x8) CMOS EPROMMicrochip-Technology-Inc-VSOP280°C70°C67 K
27C256-90I/VS256K (32x8) CMOS EPROMMicrochip-Technology-Inc-VSOP28-40°C85°C67 K
FAR-F5CH-902M50-L2EW-RPiezoelectric SAW BPF (700 to 1000 MHz)Fujitsu-MicroelectronisSMT6-30°C85°C441 K
MB84VD2229XEE-90-PBSStacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 8M(x8/x16) static RAMFujitsu-Microelectronisplastic FBGA71-25°C85°C1 M
MB84VD23280EA-90-PBSStacked MCP (multi-chip package) flash memory & SRAM 64M(x8/x16) flash memory & 8M(x8/x16) static RAMFujitsu-Microelectronisplastic FBGA101-25°C85°C771 K
MB84VD23280EE-90-PBSStacked MCP (multi-chip package) flash memory & SRAM 64M(x8/x16) flash memory & 8M(x8/x16) static RAMFujitsu-Microelectronisplastic FBGA101-25°C85°C771 K
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