| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| HY57V648010TC-12 | 4Mbit x 2bank x 8 SDRAM, LVTTL, 120ns | distributor | TSOP II | 54 | 0°C | 70°C | 887 K |
| HY57V648010TC-15 | 4Mbit x 2bank x 8 SDRAM, LVTTL, 150ns | distributor | TSOP II | 54 | 0°C | 70°C | 887 K |
| RD38F1010C0ZBL0 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD38F1010C0ZTL0 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| TSMBJ1010C | Bi-directional 100Amp, 100V, thyristor surge protective device | Microsemi-Corporation | - | 3 | -40°C | 150°C | 179 K |
| uPD70108HCZ-10 | 16-bit MOS microprocessor, 10MHz | NEC-Electronics-Inc- | PDIP | 40 | -40°C | 85°C | 5 M |
| uPD70108HCZ-12 | 16-bit MOS microprocessor, 12.5MHz | NEC-Electronics-Inc- | PDIP | 40 | -40°C | 85°C | 5 M |
| uPD70108HCZ-16 | 16-bit MOS microprocessor, 16MHz | NEC-Electronics-Inc- | PDIP | 40 | -40°C | 85°C | 5 M |
| uPD70108HGC-10-3B6 | 16-bit MOS microprocessor, 10MHz | NEC-Electronics-Inc- | PQFP | 52 | -40°C | 85°C | 5 M |
| uPD70108HGC-12-3B6 | 16-bit MOS microprocessor, 12.5MHz | NEC-Electronics-Inc- | PQFP | 52 | -40°C | 85°C | 5 M |
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