Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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M38025E1DXXXSP | RAM size: 768bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 64 | -20°C | 85°C | 554 K |
M38025E2DXXXSP | RAM size: 768bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 64 | -20°C | 85°C | 554 K |
M38025E3DXXXSP | RAM size: 768bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 64 | -20°C | 85°C | 554 K |
M38025E4DXXXSP | RAM size: 768bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 64 | -20°C | 85°C | 554 K |
M38025E5DXXXSP | RAM size: 768bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 64 | -20°C | 85°C | 554 K |
M38025E6DXXXSP | RAM size: 768bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 64 | -20°C | 85°C | 554 K |
M38025E7DXXXSP | RAM size: 768bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 64 | -20°C | 85°C | 554 K |
M38025E8-XXXSP | RAM size: 768bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 64 | -20°C | 85°C | 554 K |
M38025E8DXXXSP | RAM size: 768bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | DIP | 64 | -20°C | 85°C | 554 K |
XQ4025E-3CB228M | QPRO QML high-reliability FPGA. | distributor | Top brazed ceramic Q | 228 | -55°C | 125°C | 304 K |
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