Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
CMX602BD4 | Calling line identifier plus call waiting | MX-COM-Inc- | SOIC | 16 | -40°C | 85°C | 337 K |
CMX602BE4 | Calling line identifier plus call waiting | MX-COM-Inc- | TSSOP | 16 | -40°C | 85°C | 337 K |
E28F002BL-B150 | 2-Mbit(128K x 8) low-power boot block flash memory. Access speed 150 ns | Intel-Corporation | TSOP | 40 | -20°C | 70°C | 496 K |
E28F002BL-T150 | 2-Mbit(128K x 8) low-power boot block flash memory. Access speed 150 ns | Intel-Corporation | TSOP | 40 | -20°C | 70°C | 496 K |
E28F002BX-B120 | 2-Mbit(128K x 16) boot block flash memory. Access speed 120 ns | Intel-Corporation | TSOP | 40 | 0°C | 70°C | 562 K |
E28F002BX-B80 | 2-Mbit(128K x 16) boot block flash memory. Access speed 80 ns | Intel-Corporation | TSOP | 40 | 0°C | 70°C | 562 K |
GAL6002B-20LJ | High performance E2 CMOS FPL generic array logic | Lattice-Semiconductor-Corporation | PLCC | 28 | -55°C | 125°C | 244 K |
GAL6002B-20LP | High performance E2 CMOS FPL generic array logic | Lattice-Semiconductor-Corporation | PDIP | 24 | -55°C | 125°C | 244 K |
TE28F002BX-B80 | 2-Mbit(128K x 16) boot block flash memory. Access speed 80 ns | Intel-Corporation | TSOP | 40 | -40°C | 85°C | 562 K |
TE28F002BX-T80 | 2-Mbit(256K x 8) boot block flash memory. Access speed 80 ns | Intel-Corporation | TSOP | 40 | -40°C | 85°C | 562 K |
<< [56] [57] [58] [59] [60] 61 [62] [63] [64] [65] [66] >> |
---|