| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| ULC0406FC05C | 5.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0406 | - | -55°C | 150°C | 169 K |
| ULC0406FC08C | 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0406 | - | -55°C | 150°C | 169 K |
| ULC0406FC12C | 12.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0406 | - | -55°C | 150°C | 169 K |
| ULC0406FC15C | 15.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0406 | - | -55°C | 150°C | 169 K |
| ULC0406FC24C | 24.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0406 | - | -55°C | 150°C | 169 K |
| ULC0406FC3.3C | 3.3V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0406 | - | -55°C | 150°C | 169 K |
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