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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962P0053601QUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorCeramic flatpack36-55°C125°C128 K
5962P0053601QXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-55°C125°C128 K
5962P0053601QXX512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-55°C125°C128 K
5962P0053602QUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962P0053602QXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053603QUC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorCeramic flatpack36-55°C125°C128 K
5962P0053604QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962P0053604QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962P0053604QUC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
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