| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 90-U0901-128 | IEEE EUI-64 Node Address Chip | Dallas-Semiconductor | - | - | 0°C | 85°C | 46 K |
| 90-U09P1-128 | IEEE EUI-64 Node Address Chip | Dallas-Semiconductor | TSOC | 6 | -40°C | 85°C | 46 K |
| DS1809U-100 | Dallastat | Dallas-Semiconductor | USOP | 8 | -40°C | 85°C | 87 K |
| DS1809Z-010 | Dallastat | Dallas-Semiconductor | SOIC | 8 | -40°C | 85°C | 87 K |
| DS1809Z-050 | Dallastat | Dallas-Semiconductor | SOIC | 8 | -40°C | 85°C | 87 K |
| DS1809Z-100 | Dallastat | Dallas-Semiconductor | SOIC | 8 | -40°C | 85°C | 87 K |
| DS2409P/T&R | MicroLAN Coupler | Dallas-Semiconductor | - | 6 | 0°C | 85°C | 415 K |
| DS9097U-009 | Universal 1-Wire COM Port Adapter | Dallas-Semiconductor | - | - | 0°C | 70°C | 26 K |
| TISP3095H3SL | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | SL | - | - | - | 231 K |
| TISP7095H3SL | Triple Symmetrical Overvoltage TISP for 3 Wire ISDN / Interwire Protection | Power-Innovations | SL | - | - | - | 283 K |
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