Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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A80960KB-25 | Embedded 32-bit microprocessor with integrated floating-point unit. | Intel-Corporation | PGA | 132 | 0°C | 85°C | 418 K |
N80960SA-10 | Embedded 32-bit microprocessor with 16-bit burst data bus | Intel-Corporation | PLCC | 84 | 0°C | 85°C | 374 K |
N80960SA-16 | Embedded 32-bit microprocessor with 16-bit burst data bus | Intel-Corporation | PLCC | 84 | 0°C | 85°C | 374 K |
N80960SA-20 | Embedded 32-bit microprocessor with 16-bit burst data bus | Intel-Corporation | PLCC | 84 | 0°C | 85°C | 374 K |
S80960SA-16 | Embedded 32-bit microprocessor with 16-bit burst data bus | Intel-Corporation | QFP | 80 | 0°C | 100°C | 374 K |
TA80960CA-16 | 32-Bit high-performance embedded processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
TA80960CA-25 | 32-Bit high-performance embedded processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
TA80960CF-16 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
TA80960CF-25 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
TA80960CF-30 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
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