Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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AS7C1024-20JC | 5V 128K x 8 CM0S SRAM (evolutionary pinout), 20ns access time | Alliance-Semiconductor-Corporation | plastic SOJ | 32 | 0°C | 70°C | 211 K |
AS7C1024-20JI | 5V 128K x 8 CM0S SRAM (evolutionary pinout), 20ns access time | Alliance-Semiconductor-Corporation | plastic SOJ | 32 | -40°C | 85°C | 211 K |
AS7C1024-20TC | 5V 128K x 8 CM0S SRAM (evolutionary pinout), 20ns access time | Alliance-Semiconductor-Corporation | TSOPI | 32 | 0°C | 70°C | 211 K |
AS7C1024-20TI | 5V 128K x 8 CM0S SRAM (evolutionary pinout), 20ns access time | Alliance-Semiconductor-Corporation | TSOPI | 32 | -40°C | 85°C | 211 K |
AS7C31024-20TC | 3.3V 128K x 8 CM0S SRAM (evolutionary pinout), 20ns access time | Alliance-Semiconductor-Corporation | TSOPI | 32 | 0°C | 70°C | 211 K |
AS7C31024-20TI | 3.3V 128K x 8 CM0S SRAM (evolutionary pinout), 20ns access time | Alliance-Semiconductor-Corporation | TSOPI | 32 | -40°C | 85°C | 211 K |
HDMP-1024 | Low cost gigabit rate transmit, receive chip set with TTL I,O | distributor | - | 80 | -40°C | 130°C | 321 K |
HDMP-1024 | Low cost gigabit rate transmit, receive chip set with TTL I,O | distributor | - | 80 | -40°C | 130°C | 321 K |
ISPLS1024-125LT100 | 125 MHz in-system prommable high density PLD | Lattice-Semiconductor-Corporation | TQFP | 100 | -55°C | 125°C | 162 K |
ISPLS1024-200LT100 | 200 MHz in-system prommable high density PLD | Lattice-Semiconductor-Corporation | TQFP | 100 | -55°C | 125°C | 162 K |
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