| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| FAR-C4CN-11059-K00-R | Piezoelectric resonator (4 to 23.9 MHz) | Fujitsu-Microelectronis | SMT | 3 | -30°C | 85°C | 61 K |
| FAR-C4CN-11059-K10-R | Piezoelectric resonator (4 to 23.9 MHz) | Fujitsu-Microelectronis | SMT | 3 | -30°C | 85°C | 61 K |
| FAR-C4CN-11059-K20-R | Piezoelectric resonator (4 to 23.9 MHz) | Fujitsu-Microelectronis | SMT | 3 | -30°C | 85°C | 61 K |
| FAR-C4CN-11059-M00-R | Piezoelectric resonator (4 to 23.9 MHz) | Fujitsu-Microelectronis | SMT | 3 | -30°C | 85°C | 61 K |
| MB84VA2105-10 | MCP (multi-chip package) flash memory & SRAM 8M(x8) flash memory & 1M(x8) static RAM | Fujitsu-Microelectronis | plastic FBGA | 48 | -20°C | 85°C | 401 K |
| MPC2105ASG66 | 256KB and 1MB burstRAM secondary cache module | Motorola | Gold Pad SIMM | 178 | 0°C | 70°C | 245 K |
| MPC2105P | 256KB/ 512KB burstRAM secondary cache module | Motorola | GPD | 178 | 0°C | 70°C | 158 K |
| MPC2105PDG66 | 256KB/ 512KB burstRAM secondary cache module | Motorola | GPD | 178 | 0°C | 70°C | 158 K |
| MPC2105PDG66 | 256KB/ 512KB burstRAM secondary cache module | Motorola | GPD | 178 | 0°C | 70°C | 158 K |
| MPC2105SG66 | 256KB and 512KB burstRAM secondary cache module | Motorola | Gold Pad SIMM | 182 | 0°C | 70°C | 228 K |
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