Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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EC11FS2 | 200 V, diode | distributor | SM | 2 | -40°C | 150°C | 30 K |
EC11FS4 | 400 V, diode | distributor | SM | 2 | -40°C | 150°C | 30 K |
EMRS-11FTR | 350-2000 MHz, surface mount mixer, RF power 50mW, peak IF current 40mA | M-A-COM---manufacturer-of-RF | SM | 6 | -55°C | 100°C | 60 K |
H11F1 | Photo FET optocouplers | Fairchild-Semiconductor | DIP | 6 | -55°C | 100°C | 403 K |
H11F1 | 6V; 60mA photon coupled bilateral analog fet | distributor | - | 6 | -55°C | 100°C | 62 K |
H11F2 | Photo FET optocouplers | Fairchild-Semiconductor | DIP | 6 | -55°C | 100°C | 403 K |
H11F2 | 6V; 60mA photon coupled bilateral analog fet | distributor | - | 6 | -55°C | 100°C | 62 K |
H11F3 | Photo FET optocouplers | Fairchild-Semiconductor | DIP | 6 | -55°C | 100°C | 403 K |
H11F3 | 6V; 60mA photon coupled bilateral analog fet | distributor | - | 6 | -55°C | 100°C | 62 K |
uPD77111F1-xxx-CN1 | 16-bit fixed-point digital processor, 75 MHz, internal instruction memory RAM 1K words x 32 bits mask ROM 31.75K words x 32 bits, data memory RAM 3K words x 16 bits x 2 banks mask ROM 16K words x 16 bits x 2 banks, (xxx - indicates ROM code suffix.) | NEC-Electronics-Inc- | BGA | 80 | -40°C | 85°C | 466 K |
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