Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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CY7C1312V18-133BZC | 18-Mb SRAM two-word burst architecture, 133MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 445 K |
CY7C1312V18-167BZC | 18-Mb SRAM two-word burst architecture, 167MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 445 K |
CY7C1312V18-200BZC | 18-Mb SRAM two-word burst architecture, 200MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 445 K |
HFBR-1312T | 1300 nm fiber optic transmitter, 1300 nm | distributor | - | 8 | -40°C | 85°C | 182 K |
LT1312CS8 | Single PCMCIA VPP driver/regulator | Linear-Technology | SO | 8 | 0°C | 70°C | 232 K |
PWR1312 | 1.5 watt unregulated DC/DC converter. Nom.input voltage 15VDC, rated output voltage 5VDC, rated output current 300mA. | distributor | DIP | 24 | -40°C | 85°C | 338 K |
WED9LC6816V1312BI | 3.3V power supply; 256K x 32 SSRAM / 4M x 32 SDRAM. External memory solution for Texas instruments TMS320C6000 DSP | distributor | BGA | 153 | -40°C | 85°C | 400 K |
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