| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT22VP10E-15UCA | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15UCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15UCC | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10E-15UCX | Radiation Hardened PAL. CMOS I/O: 15.5ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-15UCA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Lead finish solder. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-15UCC | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT22VP10T-15UCX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| UT8R512K8-15UWA | 512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 109 K |
| UT8R512K8-15UWC | 512K x 18 SRAM. 15ns access time. Lead finish gold. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 109 K |
| UT8R512K8-15UWX | 512K x 18 SRAM. 15ns access time. Lead finish factory option. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 109 K |
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