Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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AS6UA25616-BC | 2.3V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | 0°C | 70°C | 190 K |
AS6UA25616-BI | 2.3V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | -40°C | 85°C | 190 K |
AS6UA25616-TC | 2.3V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | 0°C | 70°C | 190 K |
AS6UA25616-TI | 2.3V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOP | 44 | -40°C | 85°C | 190 K |
AS6UA51216-BC | 1.65V to 3.6V 512K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | 0°C | 70°C | 205 K |
AS6UA51216-TC | 1.65V to 3.6V 512K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | 0°C | 70°C | 205 K |
AS6UA51216-TI | 1.65V to 3.6V 512K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | -40°C | 85°C | 205 K |
CSPST16-510J | Chip scale termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 52 K |
CSPST16-560F | Chip scale termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 52 K |
CSPST16-560J | Chip scale termination array | California-Micro-Devices | Chip scale | 8 | -40°C | 85°C | 52 K |
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