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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
AT28BV16-25JC16K (2K x 8) battery-voltage CMOS EPPROMATMEL-Corporationplastic PLCC320°C70°C398 K
AT28BV16-25JI16K (2K x 8) battery-voltage CMOS EPPROMATMEL-Corporationplastic PLCC32-40°C85°C398 K
AT28BV16-25PC16K (2K x 8) battery-voltage CMOS EPPROMATMEL-Corporationplastic PDIP240°C70°C398 K
AT28BV16-25PI16K (2K x 8) battery-voltage CMOS EPPROMATMEL-Corporationplastic PDIP24-40°C85°C398 K
AT28BV16-25SC16K (2K x 8) battery-voltage CMOS EPPROMATMEL-Corporationplastic SOIC240°C70°C398 K
AT28BV16-25SI16K (2K x 8) battery-voltage CMOS EPPROMATMEL-Corporationplastic SOIC24-40°C85°C398 K
AT28BV16-25TI16K (2K x 8) battery-voltage CMOS EPPROMATMEL-Corporationplastic TSOP28-40°C85°C398 K
CSPST16-220FChip scale termination arrayCalifornia-Micro-DevicesChip scale8-40°C85°C52 K
CSPST16-220JChip scale termination arrayCalifornia-Micro-DevicesChip scale8-40°C85°C52 K
GLT44016-25TC25ns; 256K x 16 CMOS dynamic RAM with extended data outputdistributorTSOP400°C70°C748 K
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