| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| ACM1602Z-NFBW-T | 0.3-5.5V; 16characters x 2lines; dot size:0.55x0.60mm; dot pitch:0.60x0.65mm; AZ display | distributor | - | - | -20°C | 70°C | 414 K |
| ACM1602Z-NFBW-T | 0.3-5.5V; 16characters x 2lines; dot size:0.55x0.60mm; dot pitch:0.60x0.65mm; AZ display | distributor | - | - | -20°C | 70°C | 414 K |
| AEP16024 | EP-relay. High voltage and current, out-off capacity in a compact package. Nominal voltage 24 V DC. Contact arrangement: 1 form A. Contact rating: 60A. Without indicator contact. | distributor | - | 6 | -40°C | 80°C | 234 K |
| AEV16024 | EV-relay. Compact but cut off DC power current, power capsule contact relay. Coil voltage 24 V DC. Contact arrangement: 1 form A. Contact rating: 60A. Without indicator contact. | distributor | - | 6 | -40°C | 80°C | 216 K |
| CR1602AA | TO-220 series Sibod, glass passivated junction, bi-directional. Pins 1-2&3-2: Vr = 65.0V, Vbo = 95.0V,max. Pins 1-3: Vr = 130.0V, Vbo = 190.0V,max. Ir = 1.0uA. Vt = 5.0V,typ. Ibo = 800.0mA. | distributor | - | 3 | -55°C | 175°C | 79 K |
| CR1602AB | TO-220 series Sibod, glass passivated junction, bi-directional. Pins 1-2&3-2: Vr = 65.0V, Vbo = 95.0V,max. Pins 1-3: Vr = 130.0V, Vbo = 190.0V,max. Ir = 1.0uA. Vt = 5.0V,typ. Ibo = 800.0mA. | distributor | - | 3 | -55°C | 175°C | 79 K |
| CR1602AC | TO-220 series Sibod, glass passivated junction, bi-directional. Pins 1-2&3-2: Vr = 65.0V, Vbo = 95.0V,max. Pins 1-3: Vr = 130.0V, Vbo = 190.0V,max. Ir = 1.0uA. Vt = 10.0V,typ. Ibo = 800.0mA. | distributor | - | 3 | -55°C | 175°C | 79 K |
| RD28F1602C3B70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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