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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
KM416C1004CJ-L455V, 1M x 16 bit CMOS DRAM with extended data out, 45nsSamsung-ElectronicSOJ420°C70°C1 M
KM416C1004CJ-L55V, 1M x 16 bit CMOS DRAM with extended data out, 50nsSamsung-ElectronicSOJ420°C70°C1 M
KM416C1004CJ-L55V, 1M x 16 bit CMOS DRAM with extended data out, 50nsSamsung-ElectronicSOJ420°C70°C1 M
KM416C1004CT-L55V, 1M x 16 bit CMOS DRAM with extended data out, 50nsSamsung-ElectronicTSOP II440°C70°C1 M
KM416C1004CT-L65V, 1M x 16 bit CMOS DRAM with extended data out, 60nsSamsung-ElectronicTSOP II440°C70°C1 M
KM416C1204CT-L55V, 1M x 16 bit CMOS DRAM with extended data out, 50nsSamsung-ElectronicTSOP II440°C70°C1 M
KM416C1204CT-L65V, 1M x 16 bit CMOS DRAM with extended data out, 60nsSamsung-ElectronicTSOP II440°C70°C1 M
MC68HC05B16CB8-bit single chip microcomputer, 16K bytes ROM, increased RAM and self-check ROMMotorolaSDIP56-40°C85°C1 M
MC68HC705B16CFN8-bit single chip microcomputer, 16K bytes EPROM, increased RAM, self-check replaced by bootstrap firmware, modified power-on reset routineMotorolaPLCC52-40°C85°C1 M
MC68HC705B16CFU8-bit single chip microcomputer, 16K bytes EPROM, increased RAM, self-check replaced by bootstrap firmware, modified power-on reset routineMotorolaQFP64-40°C85°C1 M
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