| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| CY7C1316V18-200BZC | 18-Mb DDR-II SRAM two-word burst architecture, 200MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 442 K |
| CY7C1318V18-200BZC | 18-Mb DDR-II SRAM two-word burst architecture, 200MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 442 K |
| CY7C1320V18-200BZC | 18-Mb DDR-II SRAM two-word burst architecture, 200MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 442 K |
| CY7C1320V18-250BZC | 18-Mb DDR-II SRAM two-word burst architecture, 250MHz | Cypress-Semiconductor | FBGA | 165 | 0°C | 70°C | 442 K |
| G903AD-DC18-2 | Relay. Coil voltage 18 VDC. Contact arrangement 1A. Cover: dust cover. Insulation class F. | distributor | - | - | -55°C | 85°C | 36 K |
| G903BD-DC18-2 | Relay. Coil voltage 18 VDC. Contact arrangement 1B. Cover: dust cover. Insulation class F. | distributor | - | - | -55°C | 85°C | 36 K |
| G903BO-DC18-2 | Relay. Coil voltage 18 VDC. Contact arrangement 1B. Cover: open frame. Insulation class F. | distributor | - | - | -55°C | 85°C | 36 K |
| G903CD-DC18-2 | Relay. Coil voltage 18 VDC. Contact arrangement 1C. Cover: dust cover. Insulation class F. | distributor | - | - | -55°C | 85°C | 36 K |
| G903CO-DC18-2 | Relay. Coil voltage 18 VDC. Contact arrangement 1C. Cover: open frame. Insulation class F. | distributor | - | - | -55°C | 85°C | 36 K |
| H18-2 | Pd=500mW, Vz=17.9V zener diode | distributor | - | - | - | - | 107 K |
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