| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| SB80C186XL12 | 16-bit high-integration embedded processor. 12 MHz | Intel-Corporation | SQFP | 80 | 0°C | 70°C | 561 K |
| SB80C186XL20 | 16-bit high-integration embedded processor. 20 MHz | Intel-Corporation | SQFP | 80 | 0°C | 70°C | 561 K |
| SB80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | SQFP | 80 | 0°C | 70°C | 561 K |
| TA80C186XL12 | 16-bit high-integration embedded processor. 12 MHz | Intel-Corporation | Ceramic PGA | 68 | -40°C | 85°C | 561 K |
| TA80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | Ceramic PGA | 68 | -40°C | 85°C | 561 K |
| TN80C186XL12 | 16-bit high-integration embedded processor. 12 MHz | Intel-Corporation | PLCC | 68 | -40°C | 85°C | 561 K |
| TN80C186XL20 | 16-bit high-integration embedded processor. 20 MHz | Intel-Corporation | PLCC | 68 | -40°C | 85°C | 561 K |
| TN80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | PLCC | 68 | -40°C | 85°C | 561 K |
| TR80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | Ceramic LCC | 68 | -40°C | 85°C | 561 K |
| TR80C186XL25 | 16-bit high-integration embedded processor. 25 MHz | Intel-Corporation | Ceramic LCC | 68 | -40°C | 85°C | 561 K |
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