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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT79R3081E40FDRIScontroller with FPAIntegrated-Device-Technology-Inc-FLATPACK840°C85°C294 K
IDT79R3081E40FDBRIScontroller with FPAIntegrated-Device-Technology-Inc-FLATPACK84-55°C125°C294 K
IDT79R3081E40MJBRIScontroller with FPAIntegrated-Device-Technology-Inc-MQUAD84-55°C125°C294 K
IDT79RV3081E40MJBRIScontroller with FPAIntegrated-Device-Technology-Inc-MQUAD84-55°C125°C294 K
LT1E40ALeadless chip LED deviceSharpPWB2-30°C85°C96 K
LT1E45AChip LED deviceSharp---25°C85°C13 K
M37531E4FPSingle-chip 8-bit CMOS microcomputer. PROM 8192 bytes, RAM 256 bytes, One time PROMMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic SSOP36-20°C85°C631 K
M37531E4GPSingle-chip 8-bit CMOS microcomputer. PROM 8192 bytes, RAM 256 bytes, One time PROMMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic SSOP36-20°C85°C631 K
M37531E4T-XXXGPSingle-chip 8-bit CMOS microcomputer. PROM 8192 bytes, RAM 256 bytes, One time PROMMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic SSOP36-40°C85°C631 K
M37531E4V-XXXGPSingle-chip 8-bit CMOS microcomputer. PROM 8192 bytes, RAM 256 bytes, One time PROMMitsubishi-Electric-Corporation-Semiconductor-GroupPlastic SSOP36-40°C125°C631 K
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