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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT72V821L10TF1024 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-STQFP640°C70°C150 K
IDT72V831L10PF2048 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V831L10PF2048 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V831L15PF2048 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V831L15PF2048 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V831L15PFI2048 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-TQFP64-40°C85°C150 K
IDT72V831L15TF2048 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-STQFP640°C70°C150 K
IDT72V831L15TFI2048 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-STQFP64-40°C85°C150 K
IDT72V841L10PF4096 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V841L15PF4096 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
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