| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| CY37512P208-100NI | 5V, ISR high-performance CPLDs, 512 macrocells, 100MHz | Cypress-Semiconductor | PQFP | 208 | -40°C | 85°C | 1 M |
| CY37512P208-83NC | 5V, ISR high-performance CPLDs, 512 macrocells, 83MHz | Cypress-Semiconductor | PQFP | 208 | 0°C | 70°C | 1 M |
| CY37512P208-83NI | 5V, ISR high-performance CPLDs, 512 macrocells, 83MHz | Cypress-Semiconductor | PQFP | 208 | -40°C | 85°C | 1 M |
| LM1208N | 130 MHz/85 MHz RGB video amplifier system with blanking | distributor | DIP | 28 | -20°C | 80°C | 917 K |
| LM1208N | 130 MHz/85 MHz RGB video amplifier system with blanking | distributor | DIP | 28 | -20°C | 80°C | 917 K |
| RD28F3208C3B70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3B90 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3T70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3T90 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3T90 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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