Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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HYM721000GS-70 | 1M x 72bit DRAM module | Infineon-formely-Siemens | - | 168 | 0°C | 70°C | 83 K |
HYS64V2100GCU-10 | 2M x 64bit SDRAM module | Infineon-formely-Siemens | - | 168 | 0°C | 70°C | 75 K |
HYS64V2100GU-10 | 2M x 64bit SDRAM module | Infineon-formely-Siemens | - | 168 | 0°C | 70°C | 75 K |
HYS72V2100GCU-10 | 2M x 72bit SDRAM module | Infineon-formely-Siemens | - | 168 | 0°C | 70°C | 75 K |
HYS72V2100GU-10 | 2M x 72bit SDRAM module | Infineon-formely-Siemens | - | 168 | 0°C | 70°C | 75 K |
IDT74FCT32932100PV | 3.3V low skew PLL-based CMOS clock driver | Integrated-Device-Technology-Inc- | SSOP | 48 | -40°C | 85°C | 131 K |
IDT74FCT3932100PA | 3.3V low skew PLL-based CMOS clock driver | Integrated-Device-Technology-Inc- | TSSOP | 48 | -40°C | 85°C | 131 K |
IDT74FCT3932100PV | 3.3V low skew PLL-based CMOS clock driver | Integrated-Device-Technology-Inc- | SSOP | 48 | -40°C | 85°C | 131 K |
KOM2100B | 6-chip silicon PIN photodiode array | Infineon-formely-Siemens | - | 12 | -40°C | 80°C | 238 K |
KOM2100BF | 6-chip silicon PIN photodiode array | Infineon-formely-Siemens | - | 12 | -40°C | 80°C | 238 K |
[1] [2] [3] [4] [5] 6 [7] [8] [9] [10] |
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