| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| ISPLSI2192VE-100LB144 | 100 MHz 3.3V in-system prommable superFAST high density PLD | Lattice-Semiconductor-Corporation | BGA | 144 | -55°C | 125°C | 144 K |
| ISPLSI2192VL-100LB144 | 100 MHz 2.5V in-system prommable superFAST high density PLD | Lattice-Semiconductor-Corporation | BGA | 144 | -55°C | 125°C | 163 K |
| ISPLSI2192VL-100LT128 | 100 MHz 2.5V in-system prommable superFAST high density PLD | Lattice-Semiconductor-Corporation | TQFP | 128 | -55°C | 125°C | 163 K |
| ISPLSI2192VL-135LB144 | 135 MHz 2.5V in-system prommable superFAST high density PLD | Lattice-Semiconductor-Corporation | BGA | 144 | -55°C | 125°C | 163 K |
| ISPLSI2192VL-135LT128 | 135 MHz 2.5V in-system prommable superFAST high density PLD | Lattice-Semiconductor-Corporation | TQFP | 128 | -55°C | 125°C | 163 K |
| ISPLSI2192VL-150LB144 | 150 MHz 2.5V in-system prommable superFAST high density PLD | Lattice-Semiconductor-Corporation | BGA | 144 | -55°C | 125°C | 163 K |
| ISPLSI2192VL-150LT128 | 150 MHz 2.5V in-system prommable superFAST high density PLD | Lattice-Semiconductor-Corporation | TQFP | 128 | -55°C | 125°C | 163 K |
| NJM2190B | 3D surround processor | New-Japan-Radio-Co--Ltd--JRC | SSOP | 16 | -20°C | 75°C | 327 K |
| NJM2190D | 3D surround processor | New-Japan-Radio-Co--Ltd--JRC | DIP | 16 | -20°C | 75°C | 327 K |
| NJM2190M | 3D surround processor | New-Japan-Radio-Co--Ltd--JRC | DMP | 16 | -20°C | 75°C | 327 K |
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