Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
FAR-F6CE1G4410-K220-V | Piezoelectric SAW BPF(700 to 1700 MHz) | Fujitsu-Microelectronis | SMT | 6 | -30°C | 85°C | 515 K |
FAR-F6CE1G4410-K220-U | Piezoelectric SAW BPF(700 to 1700 MHz) | Fujitsu-Microelectronis | SMT | 6 | -30°C | 85°C | 515 K |
MB84VD2208XEA-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 2M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic FBGA | 73 | -25°C | 85°C | 1 M |
MB84VD2209XEA-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 2M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic FBGA | 73 | -25°C | 85°C | 1 M |
MMBF2202PT1 | Small-signal MOSFETs TMOS single P-channel field effect transistor | Motorola | - | 3 | -55°C | 150°C | 179 K |
MPX2200A | 200 KPA on-chip temperature compensated silicon pressure sensor | Motorola | ISSUE B | 4 | -40°C | 125°C | 171 K |
MPX2200D | 200 KPA on-chip temperature compensated silicon pressure sensor | Motorola | ISSUE B | 4 | -40°C | 125°C | 171 K |
MPX2200DP | 200 KPA on-chip temperature compensated silicon pressure sensor | Motorola | ISSUE B | 4 | -40°C | 125°C | 171 K |
MPX2201DP | 200 KPA on-chip temperature compensated silicon pressure sensor | Motorola | ISSUE B | 4 | -40°C | 125°C | 171 K |
MPX2201DP | 200 KPA on-chip temperature compensated silicon pressure sensor | Motorola | ISSUE B | 4 | -40°C | 125°C | 171 K |
<< [49] [50] [51] [52] [53] 54 [55] [56] [57] [58] [59] >> |
---|