| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| DS2407 | Dual Addressable Switch Plus 1 kbit Memory | Dallas-Semiconductor | - | - | 0°C | 85°C | 194 K |
| DS2407P | Dual Addressable Switch Plus 1 kbit Memory | Dallas-Semiconductor | - | 6 | 0°C | 85°C | 194 K |
| DS2409P | MicroLAN Coupler | Dallas-Semiconductor | - | 6 | 0°C | 85°C | 415 K |
| DS2409P/T&R | MicroLAN Coupler | Dallas-Semiconductor | - | 6 | 0°C | 85°C | 415 K |
| TISP2240F3D | Symmetrical Overvoltage TISP for 3 Wire Battery Backed Ringer Protection | Power-Innovations | D | - | - | - | 609 K |
| TISP2240F3DR | Symmetrical Overvoltage TISP for 3 Wire Battery Backed Ringer Protection | Power-Innovations | DR | - | - | - | 609 K |
| TISP2240F3P | Symmetrical Overvoltage TISP for 3 Wire Battery Backed Ringer Protection | Power-Innovations | P | - | - | - | 609 K |
| TISP2240F3SL | Symmetrical Overvoltage TISP for 3 Wire Battery Backed Ringer Protection | Power-Innovations | SL | - | - | - | 609 K |
| TISP3240F3D | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | D | - | - | - | 457 K |
| TISP3240F3DR | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | DR | - | - | - | 457 K |
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