| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 24LCS21-I/SN | 1K 2.5V dual mode I2C EEPROM | Microchip-Technology-Inc- | - | 8 | -40°C | 85°C | 91 K |
| 24LCS21T-/P | 1K 2.5V dual mode I2C EEPROM | Microchip-Technology-Inc- | - | 8 | 0°C | 70°C | 91 K |
| 24LCS21T-/SN | 1K 2.5V dual mode I2C EEPROM | Microchip-Technology-Inc- | - | 8 | 0°C | 70°C | 91 K |
| 24LCS21T-I/P | 1K 2.5V dual mode I2C EEPROM | Microchip-Technology-Inc- | - | 8 | -40°C | 85°C | 91 K |
| 24LCS21T-I/SN | 1K 2.5V dual mode I2C EEPROM | Microchip-Technology-Inc- | - | 8 | -40°C | 85°C | 91 K |
| 73K224L-IGT | Single-chip modem | TDK-Semiconductor-Corporation | TQFP | 44 | -40°C | 85°C | 206 K |
| 73K224L-IH | Single-chip modem | TDK-Semiconductor-Corporation | PLCC | 28 | -40°C | 85°C | 206 K |
| 73K324L-28IH | Single-chip modem | TDK-Semiconductor-Corporation | PLCC | 28 | - | - | 183 K |
| 73K324L-IGT | Single-chip modem | TDK-Semiconductor-Corporation | TQFP | 44 | - | - | 183 K |
| 73K324L-IP | Single-chip modem | TDK-Semiconductor-Corporation | - | 28 | - | - | 183 K |
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