Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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73K224BL-IGT | Single-chip modem with integrated hybrid | TDK-Semiconductor-Corporation | TQFP | 44 | - | - | 235 K |
GMS81524BLQ | HYUNDAI micro electronic, CMOS single-chip 8-bit microcontroller with A/D converter. ROM size 24K bytes, RAM size 448 bytes. Mask version. | distributor | LQFP | 64 | -20°C | 85°C | 1 M |
GMS81524BLQ | ROM/RAM size:24 Kb/448 bytes, 1-10 MHz, 2.2-5.5 V, 8 BIT single chip microcontroller | distributor | LQFP | 64 | -40°C | 85°C | 1 M |
M69AR024BL70ZB8T | 16 Mbit (1M x16) 1.8V supply, asynchronous PSRAM, 70ns | SGS-Thomson-Microelectronics | TFBGA | 48 | -30°C | 85°C | 591 K |
M69AR024BL80ZB8T | 16 Mbit (1M x16) 1.8V supply, asynchronous PSRAM, 80ns | SGS-Thomson-Microelectronics | TFBGA | 48 | -30°C | 85°C | 591 K |
MLX90224BL | Dual hall-effect latch | distributor | VA | 4 | -40°C | 150°C | 174 K |
MMBZ5224BLT1 | 2.8 V, 20 mA, 225 mW, semiconductor | distributor | - | 3 | - | - | 168 K |
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