Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
IDT7024L25FB | High-speed 4K x 16 dual-port static RAM | Integrated-Device-Technology-Inc- | FLATPACK | 84 | -55°C | 125°C | 292 K |
IDT7024L25FB | High-speed 4K x 16 dual-port static RAM | Integrated-Device-Technology-Inc- | FLATPACK | 84 | -55°C | 125°C | 292 K |
IDT7024S25FB | High-speed 4K x 16 dual-port static RAM | Integrated-Device-Technology-Inc- | FLATPACK | 84 | -55°C | 125°C | 292 K |
IDT7210L25CB | 16x16 parallel CMOS multiplier-accumulator | Integrated-Device-Technology-Inc- | DIP | 64 | -55°C | 125°C | 167 K |
IDT7210L25FB | 16x16 parallel CMOS multiplier-accumulator | Integrated-Device-Technology-Inc- | FLATPACK | 64 | -55°C | 125°C | 167 K |
IDT7210L25GB | 16x16 parallel CMOS multiplier-accumulator | Integrated-Device-Technology-Inc- | PGA | 68 | -55°C | 125°C | 167 K |
IDT7210L25JB | 16x16 parallel CMOS multiplier-accumulator | Integrated-Device-Technology-Inc- | PLCC | 68 | -55°C | 125°C | 167 K |
IDT72125L25TP | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 179 K |
IDT72125L50TP | CMOS parallel-to-serial fifo 256x16, 512x16, 1024x16 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 179 K |
<< [700] [701] [702] [703] [704] 705 [706] [707] [708] [709] [710] >> |
---|