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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT7006L25FBHigh-speed 16K x 8 dual-port static RAMIntegrated-Device-Technology-Inc-FLATPACK68-55°C125°C263 K
IDT7006L25GBHigh-speed 16K x 8 dual-port static RAMIntegrated-Device-Technology-Inc-PGA68-55°C125°C263 K
IDT7006L25JBHigh-speed 16K x 8 dual-port static RAMIntegrated-Device-Technology-Inc-PLCC68-55°C125°C263 K
IDT7006S25FBHigh-speed 16K x 8 dual-port static RAMIntegrated-Device-Technology-Inc-FLATPACK68-55°C125°C263 K
IDT7006S25JBHigh-speed 16K x 8 dual-port static RAMIntegrated-Device-Technology-Inc-PLCC68-55°C125°C263 K
IDT72031L25GBCMOS asynchronous FIFO with retransmit 1K x 9,2K x 9,4K x 9Integrated-Device-Technology-Inc-CERDIP32-55°C125°C153 K
IDT72031L25JBCMOS asynchronous FIFO with retransmit 1K x 9,2K x 9,4K x 9Integrated-Device-Technology-Inc-PLCC32-55°C125°C153 K
IDT72041L25GBCMOS asynchronous FIFO with retransmit 1K x 9,2K x 9,4K x 9Integrated-Device-Technology-Inc-CERDIP32-55°C125°C153 K
IDT72605L25PFCMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2Integrated-Device-Technology-Inc-TQFP640°C70°C209 K
IDT72615L25PFCMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2Integrated-Device-Technology-Inc-TQFP640°C70°C209 K
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