Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT7006L25FB | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | FLATPACK | 68 | -55°C | 125°C | 263 K |
IDT7006L25GB | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | PGA | 68 | -55°C | 125°C | 263 K |
IDT7006L25JB | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | PLCC | 68 | -55°C | 125°C | 263 K |
IDT7006S25FB | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | FLATPACK | 68 | -55°C | 125°C | 263 K |
IDT7006S25JB | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | PLCC | 68 | -55°C | 125°C | 263 K |
IDT72031L25GB | CMOS asynchronous FIFO with retransmit 1K x 9,2K x 9,4K x 9 | Integrated-Device-Technology-Inc- | CERDIP | 32 | -55°C | 125°C | 153 K |
IDT72031L25JB | CMOS asynchronous FIFO with retransmit 1K x 9,2K x 9,4K x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | -55°C | 125°C | 153 K |
IDT72041L25GB | CMOS asynchronous FIFO with retransmit 1K x 9,2K x 9,4K x 9 | Integrated-Device-Technology-Inc- | CERDIP | 32 | -55°C | 125°C | 153 K |
IDT72605L25PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
IDT72615L25PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
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