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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT71V256SA15PZILow power 3.3V CMOS fast SRAM 256K (32 x 8-bit)Integrated-Device-Technology-Inc-TSOP28-40°C85°C67 K
IDT71V256SA15YILow power 3.3V CMOS fast SRAM 256K (32 x 8-bit)Integrated-Device-Technology-Inc-SOJ28-40°C85°C67 K
IDT7203L25TDCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-THINDIP280°C70°C147 K
IDT7203S25TDCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-THINDIP280°C70°C147 K
IDT7204L25SOCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-DIP200°C70°C147 K
IDT7204L25TDCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-THINDIP280°C70°C147 K
IDT7204S25SOCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-DIP200°C70°C147 K
IDT7204S25TDCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-THINDIP280°C70°C147 K
IDT7205L25TDCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-THINDIP280°C70°C147 K
IDT7206L25TDCMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9Integrated-Device-Technology-Inc-THINDIP280°C70°C147 K
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