| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| QL3025-4PF144C | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 144 | 0°C | 70°C | 582 K |
| QL3025-4PF144I | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 144 | -40°C | 85°C | 582 K |
| QL3025-4PF144M | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | TQFP | 144 | -55°C | 125°C | 582 K |
| QL3025-4PQ208C | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PQFP | 208 | 0°C | 70°C | 582 K |
| QL3025-4PQ208I | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PQFP | 208 | -40°C | 85°C | 582 K |
| QL3025-4PQ208M | 25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density. | distributor | PQFP | 208 | -55°C | 125°C | 582 K |
| QL6325-4PS484M | Combining performance,density, and embedded RAM. | distributor | BGA | 484 | -55°C | 125°C | 1 M |
| QL6325-4PS516C | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | 0°C | 70°C | 1 M |
| QL6325-4PS516I | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -40°C | 85°C | 1 M |
| QL6325-4PS516M | Combining performance,density, and embedded RAM. | distributor | BGA | 516 | -55°C | 125°C | 1 M |
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