| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| D2526G862 | Wavelengh-selected direct modulated isolated DFB laser module. FC-PC connector. ITU freq. 186.2 THz. Center wavelength 1610.06 nm. Peak power 2mW. Dispersion performance 1800ps/nm(100km). | distributor | Metal/ceramic butter | 14 | -40°C | 70°C | 112 K |
| D2526G863 | Wavelengh-selected direct modulated isolated DFB laser module. FC-PC connector. ITU freq. 186.3 THz. Center wavelength 1609.19 nm. Peak power 2mW. Dispersion performance 1800ps/nm(100km). | distributor | Metal/ceramic butter | 14 | -40°C | 70°C | 112 K |
| D2526G864 | Wavelengh-selected direct modulated isolated DFB laser module. FC-PC connector. ITU freq. 186.4 THz. Center wavelength 1608.33 nm. Peak power 2mW. Dispersion performance 1800ps/nm(100km). | distributor | Metal/ceramic butter | 14 | -40°C | 70°C | 112 K |
| EL2252CM | Dual 50MHz comparator/pin receiver | distributor | SOL | 20 | 0°C | 75°C | 300 K |
| EL2252CN | Dual 50MHz comparator/pin receiver | distributor | PDIP | 14 | 0°C | 75°C | 300 K |
| EL6252CY | 2-channel laser diode driver + oscillator | distributor | MSOP | 10 | 0°C | 70°C | 39 K |
| EL7252CS | Dual input, high speed, dual channel power MOSFET driver | distributor | SOIC | 8 | -40°C | 85°C | 187 K |
| M38252M1-XXXFP | RAM size: 384 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | TQFP | 100 | -20°C | 85°C | 994 K |
| M38252M3-XXXFP | RAM size: 384 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | TQFP | 100 | -20°C | 85°C | 994 K |
| M38252M4-XXXFP | RAM size: 384 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | TQFP | 100 | -20°C | 85°C | 994 K |
| << [94] [95] [96] [97] [98] 99 [100] [101] [102] [103] [104] >> |
|---|
