| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| MC9S12DG256CPV | 16-bit microcontroller, 256K bytes of flash EEPROM, 12K bytes of RAM, 4K bytes of EEPROM | Motorola | LQFP | 112 | -40°C | 85°C | 2 M |
| MC9S12DJ256MFU | 16-bit microcontroller, 256K bytes of flash EEPROM, 12K bytes of RAM, 4K bytes of EEPROM | Motorola | QFP | 80 | -40°C | 125°C | 2 M |
| MC9S12DJ256MPV | 16-bit microcontroller, 256K bytes of flash EEPROM, 12K bytes of RAM, 4K bytes of EEPROM | Motorola | LQFP | 112 | -40°C | 125°C | 2 M |
| UT28F256T-45UPA | Radiation-hardenet 32Kx8 PROM. 45ns acces time, TTL compatible inputs, CMOS/TTL compatible outputs. Lead finish solder. Prototype. | distributor | FlatPack | 28 | -55°C | 125°C | 69 K |
| UT28F256T-45UPC | Radiation-hardenet 32Kx8 PROM. 45ns acces time, TTL compatible inputs, CMOS/TTL compatible outputs. Lead finish gold. Prototype. | distributor | FlatPack | 28 | -55°C | 125°C | 69 K |
| UT28F256T-45UPX | Radiation-hardenet 32Kx8 PROM. 45ns acces time, TTL compatible inputs, CMOS/TTL compatible outputs. Lead finish optional. Prototype. | distributor | FlatPack | 28 | -55°C | 125°C | 69 K |
| UT8R256K1615TBDCA | 256K x 16 SRAM. 15ns access time. Lead finish hot solder dipped. | distributor | TBD | 48 | -55°C | 125°C | 94 K |
| UT8R256K1615TBDCC | 256K x 16 SRAM. 15ns access time. Lead finish gold. | distributor | TBD | 48 | -55°C | 125°C | 94 K |
| UT8R256K1615TBDCX | 256K x 16 SRAM. 15ns access time. Lead finish factory option. | distributor | TBD | 48 | -55°C | 125°C | 94 K |
| UT8R256K1615TBDPC | 256K x 16 SRAM. 15ns access time. Lead finish gold. Prototype flow. | distributor | TBD | 48 | - | - | 94 K |
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